Short Description
The FINEPLACER® lambda 2 from Finetech is a sub‑micron accurate tabletop die bonder designed for precise placement and assembly of microelectronic and optoelectronic components in research and development. Its modular platform provides maximum flexibility for applications such as prototyping, process development, and specialized bonding technologies.
The system features high-resolution optical visualization that ensures accurate alignment and clear overview even for sub-micron structures. Its ergonomic design and software-assisted user guidance simplify operation, reduce setup times, and increase laboratory efficiency.
Flexible bonding technologies, including adhesive, solder, thermocompression, and ultrasonic bonding, can be individually configured. Expansion modules allow additional process options and support various substrate sizes and component types. Integrated data and media logging, touch-screen programming, and HD in-situ process observation enhance traceability and reproducibility.
The combination of precise hardware, modular architecture, and operator expertise makes the FINEPLACER® lambda 2 ideal for universities, research institutions, and industrial R&D laboratories. It supports high-precision assembly and placement processes for optoelectronic, micromechanical, and hybrid systems, facilitating collaboration between research groups through reproducible and well-documented results.
Contact Person
Prof. Gerhard Kirchmair
Research Services
Nanofabrication
The research infrastructure is "Open for Collaboration". Commercial collaborations are not possible.
Methods & Expertise for Research Infrastructure
The FINEPLACER® lambda 2 enables high-precision placement and assembly of micro- and optoelectronic components with sub-micron accuracy. In combination with the expertise of the supervising researchers, alignment and bonding processes are optimized to achieve reproducible, high-quality results in research and development projects.
The supervising experts have extensive experience in die bonding technologies, including thermocompression, adhesive, and specialized bonding methods, as well as precise optical alignment of substrates. The combination of precise hardware, software-assisted user guidance, and modular system design allows flexible applications, such as prototyping, process development, nanofabrication, or quantum optics projects.
The infrastructure is regularly used for various research applications, including the development of microstructured and optoelectronic systems. Integrated process documentation, touchscreen programming, and HD in-situ observation of components facilitate traceability and reproducibility of experiments.
This combination of advanced technology and specialized expertise supports both internal research activities and collaborations with external institutions, universities, and research laboratories, providing safe, efficient, and reproducible access to advanced nanofabrication processes.
Institute for Quantum Optics and Quantum Information Innsbruck, Austrian Academy of Sciences