Short Description
The automatic wire-bonder allows for bonding semiconductor chips. It supports ball and wedge bonding and is equipped with aluminium bond wire.
Contact Person
Renate Rupprechter
Research Services
The research infrastructure is open for collaboration. Commercial collaborations are not possible.
Methods & Expertise for Research Infrastructure
The machine allows for automatic bonding of semiconductor chips with aluminium wire. For instance bonds between gold and gold, or aluminum and gold. Our expertiese lies in bonding of ion-traps on chip.
The terms of use are defined within the framework of a scientific collaboration. Commercial use is not permitted. If you are interested in a collaboration or partnership, please contact us.