Short Description
For the construction of prototypes there is a modern automatic SMD assembly machine, a vapor phase soldering machine as well as state-of-the-art equipment for manual soldering work and rapid prototyping technology available.
A wire bonder is also available (for the connection of unpackaged microchips at laminate).
Contact Person
Univ.-Prof. DI Dr. Andreas Stelzer
Research Services
Electronic assembly, prototype construction, rapid prototyping, printed circuit boards (PCBs) and soldering technology
Methods & Expertise for Research Infrastructure
Electronic mounting- and packaging technology, electronic assembly, prototype construction, rapid prototyping, wire bonding
Allocation to research infrastructure
For details please contact the responsible scientist.