Short Description
Thermal chuck to charaterize silicon wafers with extremely low leakage current and heating and cooling option
Contact Person
Thomas Bergauer
Research Services
Charaterisation of semiconductor components and particle detectors under different temperatures
Methods & Expertise for Research Infrastructure
The thermal chuck at HEPHY enables temperature-dependent testing of silicon, SiC or other semiconductor devices and detectors. It allows heating and cooling the samples to study annealing effects and thermal behavior, ensuring precise characterization, determination of temperature-dependent parameters and aging.
only internal