Short Description
The SUSS MJB4 Mask Aligner is a compact, manual mask alignment system designed for research and small‑volume production. It is optimized for high‑precision UV photolithography of substrates up to 100 mm in diameter, offering sub‑micron resolution (< 0.5 µm). The combination of precise optics and flexible alignment mechanisms enables accurate pattern transfer for applications such as MEMS, optoelectronics, and microstructured materials.
The system supports multiple exposure modes (soft, hard, and vacuum contact) and can be equipped with single field or split field microscopes for clear pattern recognition and precise mask alignment. Its intuitive operation reduces setup time and increases laboratory efficiency. Modular upgrades, including UV‑Nanoimprint Lithography, expand the process capabilities.
With its robust design and cost-effective construction, the MJB4 is ideal for universities, research institutions, and R&D labs seeking a flexible lithography solution. High illumination uniformity, precise alignment, and fast substrate changeovers contribute to reproducible results and stable processes. Overall, the MJB4 provides a reliable foundation for advanced micro- and nano-structuring processes.
Contact Person
Gerhard Kirchmair
Research Services
Nanofabrication
The research infrastructure is "Open for Collaboration". Commercial collaborations are not possible.
Methods & Expertise for Research Infrastructure
The SUSS MJB4 Mask Aligner provides precise UV photolithography for substrates up to 100 mm in diameter, achieving sub‑micron resolution. In combination with the expertise of the supervising researchers, alignment and exposure processes are optimized to fabricate micro‑ and nanoscale structures. The infrastructure is regularly used for applications in MEMS, optoelectronics, microfluidics, and nanoimprint lithography (UV‑NIL).
The supervising scientists possess extensive experience in mask positioning, exposure parameter optimization, and process control, enabling reproducible and high-resolution pattern generation. The system supports flexible exposure modes (soft, hard, and vacuum contact) and can utilize both singlefield and splitfield microscopes for precise alignment of complex structures.
This combination of high-precision hardware and specialized expertise supports both research projects in collaboration with external institutions and pilot projects for small‑volume production. The existing documentation of processes, parameters, and successful applications facilitates rapid onboarding of new users and enables targeted, collaborative research work.
Institute for Quantum Optics and Quantum Information Innsbruck, Austrian Academy of Sciences