Kurzbeschreibung
The EVG 610 is a semi-automated system that can handle small substrate pieces and wafers up to 200 mm. The tool supports lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications, including bond alignment, nano imprint lithography (NIL) and micro contact printing.
- Supports back side lithography and bond alignment processes when configured with bottom side microscopes
- Sub-micron exposure gap repeatability in proximity exposure mode
- Unmatched exposure light uniformity at wafer level, down to ± 1.5% for small substrate applications
- Windows based user interface
Ansprechperson
Dr. Salvatore Bagiante
Research Services
Optical lithography and sample preparation
Methoden & Expertise zur Forschungsinfrastruktur
Micro- and nanofabrication processing, development of new processes, characterization, training