Basismaschine 56XXi
University of Innsbruck
The automatic wire-bonder allows for bonding semiconductor chips. It supports ball and wedge bonding and...
University of Innsbruck
The automatic wire-bonder allows for bonding semiconductor chips. It supports ball and wedge bonding and...
University of Innsbruck
Closed system cryostat that allows for attaching a vacuum chamber. The system is 19 inch...
University of Innsbruck
Optical Tweezers System (Momentum-Based Force Detection with TIMSOM Architecture) The optical tweezers system is a...
University of Innsbruck
The purpose of this setup is to integrate atomic arrays with photonic chips for applications...
University of Innsbruck
Multi-angle light scattering detector (MALS) for size exclusion chromatography (SEC): The combination of SEC/RI/MALS/VIS allows...
University of Innsbruck
The inFURNER is an electrically heated high-temperature vacuum furnace for solids that enables rapid cooling...
University of Innsbruck
Structural characterization of end products and intermediates from total synthesis Structural validation of natural products...
University of Innsbruck
The Universal Surface Tester 100 (UST 100) by Innowep is a modular measurement system designed...
University of Innsbruck
Innsbruck Box (or i-Box for short) is a test bed for studying boundary layer processes...
University of Innsbruck
Autoscan Premiere Automated Counting System for Fission Track Dating research based on the Zeiss M2m...